Chłodzenie CPU - strona 36

Inter-Tech DYNATRON A-26 - Chłodzenie powietrzem procesora

SilverStone Nitrogon NT09-115X - Chłodzenie powietrzem procesora

SilverStone krypton Series - Chłodzenie powietrzem procesora

SilverStone Nitrogon NT08-115XP - Chłodzenie powietrzem procesora

Xilence Performance C Series A250PWM - Chłodzenie powietrzem procesora

Noctua NM-AM4-UXS - Uchwyty montażowe procesora

Noctua NA-HC1 chromax.black.swap - Modowanie

Thermal Grizzly Putty Pro 100g - Podkładka termiczna

Thermally conductive gap filler to replace GPU thermal pads, with an operating temperature range of -40°C to +120°C.

TG Putty is a thermally conductive compound intended for GPU applications, offered in multiple sizes and performance variants.

• Replaces standard GPU thermal pads to bridge uneven surfaces


• Operating temperature: -40°C to +120°C


• Available contents: 30 g and 100 g


• Available variants: Basic, Advance, Pro


• Datasheet and technical information available for download

Ensures reliable thermal contact across gaps to support heat transfer between GPU components.

Thermal Grizzly Minus Pad Pro - 100x100x1.0 mm - Podkładka termiczna

Thermal pad delivering excellent thermal conductivity and outstanding compressibility for efficient heat transfer in SSDs, GPU coolers and other electronic components.

The Minus Pad Pro is an electrically non-conductive thermal pad developed to improve thermal conductivity and compressibility while remaining easy to apply.

• Excellent thermal conductivity


• Outstanding compressibility for reliable contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Easy-to-use design ensures consistent thermal contact across a range of cooling and electronic applications.

Cooler Master Hyper 212 Black X Duo CPU Cooler - Chłodzenie powietrzem procesora - Max 31 dBA

Thermal Grizzly Minus Pad Basic - 100x100x0.5 mm 2 - Podkładka termiczna

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal Grizzly Minus Pad Extreme - 120 X 20 X 3 mm - Podkładka termiczna

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Jonsbo HX6250

Jonsbo CR-1400 computer cooling system

Jonsbo CR-2000GT computer cooling system

Thermal Grizzly Minus Pad Extreme - 100 X 100 X 1.5 mm - Podkładka termiczna

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Noctua NM-M1-MP78 - Torx-based SecuFirm2+ mounting kit - Uchwyty montażowe procesora

Dynatron A-18 - Chłodzenie powietrzem procesora

Thermal Grizzly Carbonaut - 31x25mm - Podkładka termiczna

Thermal Grizzly Minus Pad 8 - 30×30×1.5mm - Podkładka termiczna

Thermal Grizzly Minus Pad 8 - 30×30×0.5mm - Podkładka termiczna

Thermaltake TH360 V2 Ultra EX ARGB

Thermaltake CL-W415-PL12SW-A computer cooling system

DeepCool AK500 WH - Chłodzenie powietrzem procesora - Max 32 dBA

Akasa AK 455-5G - Pasta termoprzewodząca