Thermal Grizzly – Pasta termoprzewodząca i chłodzenie do PC

Pasta termoprzewodząca, zaprojektowana do Overclockingu, przewodność cieplna 14,2 W/m*K, bez utwardzania, 33.84 gramy

Ramka kontaktowa CPU dla Intel 13th gen Raptor Lake & 14th gen Raptor Lake-S, może pomóc poprawić wydajność chłodzenia dzięki lepszemu kontaktowi między procesorem a chłodnicą - proszę zobaczyć film instalacyjny przed instalacją

Pasta termoprzewodząca, jasnoszara

Pasta do chłodzenia metali w płynie, pasta srebrna, gęstość: 6,29 g/cm3, temperatura pracy: -50 - 200° C, 1 gramów

Pasta termoprzewodząca, jasnoszara

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Pasta termoprzewodząca, jasnoszara

Pasta termoprzewodząca, przeznaczona do Overclockingu, przewodność cieplna 14,2 W/m*K, bez utwardzania, 2 grama

Processor heatsink paste, srebrny

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

The AM5 High Performance Heatspreader is an upgrade for AMD's Ryzen 7000 CPUs. The heatspreader's precision diamond-milled nickel-plated copper surface provides 240% more surface area. As a result, the AM5 heatspreader allows for maximum heat dissipation with air and water coolers.

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Urządzenie do monitorowania zasilania karty graficznej dla złączy GPU 12V-2x6 z pomiarem prądu dla każdego pinu, wyświetlaczem TFT-IPS, odwróconą orientacją wtyczki i aktywnym chłodzeniem.

Thermal Grizzly WireView Pro II GPU mierzy prądy, napięcia, temperatury i pobór mocy w sposób ciągły, z wizualnymi i dźwiękowymi ostrzeżeniami po przekroczeniu zdefiniowanych limitów.

Urządzenie obsługuje automatyczne logowanie danych, konfigurowalne widoki wyświetlacza, aktualizacje firmware przez USB-C oraz prowadzenie kabla pod kątem 90 stopni dla bardziej uporządkowanego zarządzania przewodami zasilającymi GPU.

Zaprojektowane do precyzyjnego monitorowania złącza, ułatwia śledzenie dostarczania mocy i rozkładu obciążenia w wysokowydajnych systemach kart graficznych.

Urządzenie do monitorowania zasilania GPU dla kart graficznych ze złączami 12V-2x6, z pomiarem prądu na każdym pinie, ciągłym monitorowaniem, wyświetlaczem TFT-IPS, rejestrowaniem danych oraz aktywnym chłodzeniem.

Thermal Grizzly WireView Pro II został zaprojektowany do monitorowania wartości istotnych dla bezpieczeństwa, takich jak prąd, napięcie, temperatura i pobór mocy, z ostrzeżeniami wizualnymi i dźwiękowymi po przekroczeniu skonfigurowanych limitów.

• Monitorowanie prądu, napięcia i mocy na każdym pinie
• Automatyczne rejestrowanie istotnych danych pracy
• Półpasywny wentylator i obudowa z aluminium obrabianego CNC
• Obsługa USB-C dla aktualizacji firmware wykonywanych przez użytkownika

Zapewnia przejrzysty wgląd w obciążenie złącza GPU i zachowanie temperatury, umożliwiając bardziej świadome monitorowanie systemu.

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

High-end thermal paste. Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.

• Designed for Overclocking
• Excellent thermal conductivity
• No curing
• Long-term durability
• No electrical conductivity!

Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus achieving remarkable heat transfer.
 

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

Thermal pad, red brown (pakiet 2)

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Wydajne rozwiązania w zakresie chłodzenia

Hydronaut Pro to pasta termoprzewodząca niezawierająca silikonu, o zoptymalizowanym składzie, odpowiednia zarówno do systemów przemysłowych, jak i wydajnych komputerów PC. Dzięki doskonałej przewodności cieplnej sprawdza się szczególnie dobrze w przypadku radiatorów o dużej powierzchni, na przykład w komputerach gamingowych z niestandardowym układem chłodzenia cieczą. Hydronaut Pro nadaje się również do procesorów podkręconych lub układów o wysokim współczynniku TDP (Intel Core i5/i7, AMD Ryzen 5/7). Pasta ta łączy wysoką wydajność z atrakcyjnym stosunkiem jakości do ceny i jest przeznaczona także do zastosowań związanych z overclockingiem.

• Odpowiednia do zastosowań przemysłowych
• Doskonała przewodność cieplna
• Nie wymaga wygrzewania (nie twardnieje)
• Nie zawiera silikonu
• Nie przewodzi prądu

Zawartość zestawu

• 1× Hydronaut Pro
• 1× Szpatułka TG
• 1× Szpatułka TG Pro
• 1× Aplikator
• 1× Certyfikat pochodzenia

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.