Thermal Grizzly – Pasta termoprzewodząca i chłodzenie do PC

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The Intel High Performance Heatspreader V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs (200s)

Scope of delivery

1x Intel High Performance Heatspreader V1
4x pan-head screws UNC thread 3/8"
1x hexagon socket wrench 5/64"
1x angle wrench Torx T20
 

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

Pasta termoprzewodząca Thermal Grizzly Duronaut Pro 6g łączy doskonałą przewodność cieplną, ekstremalną długoterminową stabilność, brak przewodnictwa elektrycznego oraz brak twardnienia z upływem czasu dla wymagających systemów chłodzenia PC i przemysłowych.

Specjalnie opracowany olej silikonowy, mikropuder aluminiowy i nanopuder tlenku cynku pomagają minimalizować efekt wypompowywania, poprawiają przyczepność do powierzchni i redukują rezystancję kontaktu termicznego.

W zestawie znajdują się Duronaut Pro 6g, aplikator, TG Spatula oraz TG Spatula Pro do efektywnego rozprowadzania w cienkich warstwach aplikacji.

Idealna dla graczy, overclockerów i wymagających konfiguracji chłodzenia, które potrzebują trwałego, wydajnego transferu ciepła między CPU a chłodzeniem.

Pasta do chłodzenia metali w płynie, pasta srebrna, gęstość: 6,29 g/cm3, temperatura pracy: -50 - 200° C, 1 gramów

TG Cleaning Wipes are cleaning cloths for cleaning surfaces so that thermal conductive materials such as thermal pastes or liquid metal can adhere well and thus develop their full thermal conductivity. Assembly aids such as the TG Kapton Insulation Sheet or the TG Shield protective coating also adhere better to cleaned surfaces. TG Cleaning Wipes are packaged as a practical complete set of 10 cleaning cloths.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Thermal pad, red brown

CPU contact sealing frame, czerwony/czarny, czarny

Device for measuring and monitoring graphics card power consumption via the 12VHPWR connector with OLED readout, connector detection, temperature sensors and an audible alarm.

The WireView Pro GPU connects between the graphics card and the power supply to display and record volts, amps and watts on an OLED screen while detecting cable specification and issuing warnings for incorrect connections, overcurrent or overheating.

• Displays current power (W), voltage (V), current (A), min/max, 60‑second average (RAVG) and total energy (Wh)


• Measures and records power only through the 12VHPWR power connector (does not measure via the motherboard PCIe slot)


• Connector detection for 150W / 300W / 450W / 600W cable specs; available in Normal and Reverse pin orientations


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors with 5 cm and 20 cm cables


• Audible buzzer alerts for incorrect cables/connections, exceeded temperature limits or adjustable current limits


• Aluminum housing with optimized cable management and an OLED for quick, review‑friendly measurements

Useful for assessing GPU power use and detecting power peaks on high‑power cards; the device can become very hot during operation, so avoid touching the casing and allow it to cool after shutdown.

Pasta termoprzewodząca, zaprojektowana do Overclockingu, przewodność cieplna 14,2 W/m*K, bez utwardzania, 33.84 gramy

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

The AM5 High Performance Heatspreader is an upgrade for AMD's Ryzen 7000 CPUs. The heatspreader's precision diamond-milled nickel-plated copper surface provides 240% more surface area. As a result, the AM5 heatspreader allows for maximum heat dissipation with air and water coolers.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Urządzenie do monitorowania zasilania karty graficznej dla złączy GPU 12V-2x6 z pomiarem prądu dla każdego pinu, wyświetlaczem TFT-IPS, odwróconą orientacją wtyczki i aktywnym chłodzeniem.

Thermal Grizzly WireView Pro II GPU mierzy prądy, napięcia, temperatury i pobór mocy w sposób ciągły, z wizualnymi i dźwiękowymi ostrzeżeniami po przekroczeniu zdefiniowanych limitów.

Urządzenie obsługuje automatyczne logowanie danych, konfigurowalne widoki wyświetlacza, aktualizacje firmware przez USB-C oraz prowadzenie kabla pod kątem 90 stopni dla bardziej uporządkowanego zarządzania przewodami zasilającymi GPU.

Zaprojektowane do precyzyjnego monitorowania złącza, ułatwia śledzenie dostarczania mocy i rozkładu obciążenia w wysokowydajnych systemach kart graficznych.

The AM5 Mycro Direct-Die RGB is a water cooler for AMD's Ryzen 7000 processors that sits directly on the chiplets of a delidded CPU. Made of nickel-plated copper, the Direct-Die water cooler offers outstanding thermal conductivity. This is further increased by an optimized structure of the microfins on the top. In addition, compared to normal water cooling, direct-die cooling eliminates the need for a layer of thermal conductive material as well as the CPU's heatspreader. This significantly improves the heat transfer from the CPU to the water cooling circuit.

Processor heatsink paste, srebrny

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

Pasta termoprzewodząca

Grease spatula (pakiet 3)

Thermal Grizzly prezentuje WireView GPU, urządzenie do pomiaru zużycia energii kart rozszerzeń PCI i wtyczkowych, które zostało opracowane we współpracy z Jonem „elmor” Sandströmem. Jednocześnie kształt adaptera w kształcie litery U umożliwia zoptymalizowanie układu kablowego dla czystego zarządzania przewodami.

Czym zajmuje się WireView GPU?
WireView GPU umożliwia pomiar zużycia energii kart rozszerzeń PCI i wtyczkowych oraz rejestruje te dane, aby określić ich zużycie. Te dane mogą być wykorzystane między innymi do określenia kosztów związanych z poborem mocy przez kartę graficzną lub porównania jej poboru mocy z innymi kartami graficznymi - a po prostu wyglądają świetnie!

- 2 x 8-Pinów PCI-E - normalny kierunek

Nakładacz pasty termoprzewodzącej z płynnym metalem (opakowanie 3 sztuk)

Pasta termoprzewodząca, jasnoszara