The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal pad, red brown

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

Thermal pad, red brown

Thermal pad, red brown (pakiet 2)

Thermal pad, red brown

Thermal pads with improved thermal conductivity, high compressibility and electrical insulation for effective heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Advance pads are easy to use and were developed from the Minus Pad 8 to deliver improved thermal conductivity and higher compressibility.

• Excellent thermal conductivity


• High compressibility for better surface contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Improved price-performance ratio

Designed to provide reliable heat transfer and gap filling across a range of PC and electronic cooling applications.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Radiator napędu półprzewodnikowego (SSD), M.2 2280, czarny

GPU power monitoring device measures and records graphics card power through the 12VHPWR connector, displays real-time watts/volts/amps on an OLED, detects connector type, monitors temperatures and issues an audible alarm for over-current, over-temperature or misconnected/incorrect cables.

Designed for in-line measurement, the WireView Pro GPU connects between the graphics card and the PSU to log power usage with a 60-second averaging mode and to detect power peaks and incorrect cable specifications.

• OLED display showing current W, V, A, min/max, 60s average (RAVG) and total energy (Wh)


• Records power consumption for analysis and comparison, with a special 60-second measurement cycle


• Connector detection for 150 W / 300 W / 450 W / 600 W specified cables


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors (5 cm and 20 cm included)


• Audible buzzer with adjustable temperature and current limits; warns on incorrect or loose cable connections


• Available in Normal and Reverse 12VHPWR orientations and connects to the PSU via the power cable

Be aware that the WireView PCB and connectors can become very hot during use—up to about 60°C with air-cooled cards and up to 100°C with water-cooled cards without airflow—so allow it to cool before handling.

Zestaw szpatułek TG Spatula Pro (3-pack) zapewnia równomierne i precyzyjne nakładanie pasty termoprzewodzącej na CPU, zoptymalizowany tak, aby umożliwiać większy nacisk podczas rozprowadzania.

Zaprojektowane do dokładnej, równomiernej aplikacji past termoprzewodzących o wysokiej i bardzo wysokiej lepkości, te miękkie plastikowe szpatułki zmniejszają ryzyko zarysowań lub uszkodzenia powierzchni i nie reagują z metalicznymi składnikami past termoprzewodzących.

• Wygodny zestaw 3 szt.
• Miękki plastik o niższej twardości niż narzędzia metalowe
• Kształt jak kielnia zapewniający wysoką sztywność przy nacisku w dół
• Kompatybilne z Thermal Grizzly Duronaut, Aeronaut, Hydronaut, Kryonaut oraz Kryonaut Extreme

Pomaga uzyskać czyste, równomierne rozprowadzenie dla niezawodnych rezultatów z pastą termoprzewodzącą.

Podkładka termiczna Thermal Grizzly Minus Pad extreme 2 zapewnia znakomitą przewodność cieplną i niską rezystancję termiczną interfejsu dla zastosowań o wysokiej wydajności.

Thermal Grizzly Minus Pad extreme 2 został zaprojektowany tak, aby wypełniać nawet najmniejsze szczeliny cząstkami przewodzącymi ciepło dzięki kompozycji z tlenku glinu, wodorotlenku glinu i proszku aluminiowego, wspierając optymalny transfer ciepła między źródłem ciepła a chłodzeniem.

• Wysokowydajna podkładka termiczna do ekstremalnych zastosowań
• Zoptymalizowany skład materiału dla niskiej rezystancji termicznej interfejsu
• Miękka konsystencja dobrze dopasowuje się do powierzchni styku
• Elektrycznie nieprzewodząca
• Nie utwardza się ani nie twardnieje z upływem czasu, nawet przy długotrwałym użytkowaniu

Niezawodny materiał interfejsu dla stabilnego, wydajnego transferu ciepła w wymagających konfiguracjach.

CPU contact frame for LGA 1851 (Intel 200 series). Can help improve cooling performance with better contact between CPU and cooler.

 Included in the package:

• 1x Intel 1851 CPU Contact Frame V1
• 4x Cylinder head screws with 3/8" UNC threads
• 1x 5/64" hex key
• 1x Torx T20 key

Grease spatula (pakiet 3)

TG Cleaning Wipes are cleaning cloths for cleaning surfaces so that thermal conductive materials such as thermal pastes or liquid metal can adhere well and thus develop their full thermal conductivity. Assembly aids such as the TG Kapton Insulation Sheet or the TG Shield protective coating also adhere better to cleaned surfaces. TG Cleaning Wipes are packaged as a practical complete set of 10 cleaning cloths.

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management.

What does the WireView GPU do?
The WireView GPU enables the measurement of the power consumption of PCI expansion and plug-in cards and logs this data to determine the power consumption. This data can be used, among other things, to determine the power costs of a graphics card or to compare the power consumption with other graphics cards - and just plain looks cool!

- 3 x 8-Pins PCI-E - normal direction

Ramka kontaktowa CPU dla Intel 13th gen Raptor Lake & 14th gen Raptor Lake-S, może pomóc poprawić wydajność chłodzenia dzięki lepszemu kontaktowi między procesorem a chłodnicą - proszę zobaczyć film instalacyjny przed instalacją

Część/akcesorium systemu chłodzenia komputera Thermal Grizzly TG-GG-01 TG GPU Guard to wysoce ściśliwa piankowa uszczelka zaprojektowana dla rdzeni GPU, pomagająca chronić pobliskie komponenty podczas stosowania ciekłego metalu lub innych elektrycznie przewodzących materiałów termoprzewodzących.

TG GPU Guard osłania elementy montowane powierzchniowo (SMD) obok GPU i jest nieco wyższy niż rdzeń GPU, dzięki czemu nacisk montażowy ściska piankę, aby wyrównać różnice wysokości między PCB a chłodzeniem i pomóc zapobiec rozlewaniu się pasty termicznej na inne komponenty. Ogranicza też kontakt ciekłego metalu z tlenem, aby wydłużyć jego żywotność, i jest odporny na gal.

• Wysoce ściśliwa piankowa uszczelka dla rdzeni GPU
• Chroni komponenty elektroniczne podczas stosowania przewodzących materiałów termoprzewodzących
• Osłania SMD obok GPU i jest nieco wyższa niż rdzeń GPU
• Wysokość materiału bazowego 0.8 mm, ściśliwa do 0.15 mm
• Pomaga zapobiec rozlewaniu się ciekłego metalu na komponenty PCB
• Odporna na gal

Idealne do czystszej, bezpieczniejszej aplikacji ciekłego metalu i trwalszej pracy interfejsu termicznego na kartach graficznych.

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

Thermal Grizzly TG Shield to wysokotemperaturowe powłoki konforemne służące do ochrony komponentów przed zwarciem ciekłometalowym. TG Shield szybko schnie, co umożliwia szybką aplikację i zapewni niezawodną ochronę komponentów PC w połączeniu z ciekłym metalem.

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity